基本信息:
- 专利标题： 엘이디 어레이 기판
- 专利标题（英）：A led array board
- 专利标题（中）：LED阵列板
- 申请号：KR1020100048674 申请日：2010-05-25
- 公开(公告)号：KR1020100131918A 公开(公告)日：2010-12-16
- 发明人： 허순영 , 이현미 , 한승준 , 강민석
- 申请人： 주식회사 이그잭스
- 申请人地址： 경상북도 구미시 *공단로*길 ***-** (공단동)
- 专利权人： 주식회사 이그잭스
- 当前专利权人： 주식회사 이그잭스
- 当前专利权人地址： 경상북도 구미시 *공단로*길 ***-** (공단동)
- 代理人： 특허법인 신세기
- 优先权： KR1020090050321 2009-06-08
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L33/64
摘要：
PURPOSE: An LED array substrate is provided to reduce process costs and manufacturing time by forming an electric circuit though the direct print with a conductive paste including a heat resistance binder and a conductive particle. CONSTITUTION: An alumina insulation layer is formed on an aluminum base layer(2) by anodizing. A conductive paste is formed on the alumina insulation layer. The conductive paste includes a conductive particle and a heat resistance binder. An electric circuit(3) is formed with the direct print with conductive paste compounds. An electric circuit protection insulation layer(5) covers the electric circuit except the contact with an LED.
摘要（中）：
目的：提供一种LED阵列基板，通过使用包括耐热粘合剂和导电颗粒的导电浆直接印刷形成电路来降低工艺成本和制造时间。 构成：通过阳极氧化在铝基底层（2）上形成氧化铝绝缘层。 在氧化铝绝缘层上形成导电膏。 导电浆料包括导电颗粒和耐热粘合剂。 用导电糊剂化合物直接印刷形成电路（3）。 除了与LED的接触之外，电路保护绝缘层（5）覆盖电路。
公开/授权文献:
- KR101027422B1 엘이디 어레이 기판 公开/授权日：2011-04-11