基本信息:
- 专利标题： 코어 기판 및 프린트 배선판
- 专利标题（英）：Core substrate and printed wiring board
- 专利标题（中）：核心基板和印刷电路板
- 申请号：KR1020090020281 申请日：2009-03-10
- 公开(公告)号：KR1020090124917A 公开(公告)日：2009-12-03
- 发明人： 요시무라히데아키 , 이이다겐지 , 아베도모유키 , 마에하라야스토모 , 나카가와다카시 , 히라노신
- 申请人： 후지쯔 가부시끼가이샤
- 申请人地址： 일본국 가나가와켄 가와사키시 나카하라꾸 가미고다나카 *초메 *-*
- 专利权人： 후지쯔 가부시끼가이샤
- 当前专利权人： 후지쯔 가부시끼가이샤
- 当前专利权人地址： 일본국 가나가와켄 가와사키시 나카하라꾸 가미고다나카 *초메 *-*
- 代理人： 강승옥; 송승필
- 优先权： JPJP-P-2008-143450 2008-05-30
- 主分类号： H05K1/05
- IPC分类号： H05K1/05 ; H05K3/46
摘要：
PURPOSE: A core board and a printed wiring board are provided to suppress generation of thermal stress within the core board by having a pair of insulating layers having high strength. CONSTITUTION: A core layer(13) is formed by impregnating resin in carbon fibers. A through hole(17) for a basic hole is formed in the core layer, and passes through the core layer from a surface to a back surface. A filler(27) of a cylindrical shape is filled within the through hole for the basic hole. A pair of insulating layers(22,23) is formed by impregnating resin in glass fibers. In the insulating layers, the core layer is inserted between a surface and a back surface. A conductive via(25) is formed along an inner wall surface of the through hole. A through hole(24) passes through the core layer along a central axis of the through hole for the basic hole.
摘要（中）：
目的：提供一种芯板和印刷电路板，通过具有一对具有高强度的绝缘层来抑制芯板内的热应力产生。 构成：通过将树脂浸渍在碳纤维中形成芯层（13）。 在芯层中形成用于基本孔的通孔（17），并且从表面到背面通过芯层。 圆柱形填料（27）填充在基孔的通孔内。 通过将树脂浸渍在玻璃纤维中形成一对绝缘层（22,23）。 在绝缘层中，芯层插入在表面和背面之间。 沿着通孔的内壁表面形成导电通孔（25）。 通孔（24）沿着用于基本孔的通孔的中心轴线穿过芯层。
公开/授权文献:
- KR101164301B1 코어 기판 및 프린트 배선판 公开/授权日：2012-07-09
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/03 | ..基片材料的应用 |
| ------------H05K1/05 | ...绝缘的金属基片 |