发明公开
KR20070084888A APPARATUS FOR FORMING TRANSITION METAL OXIDE MEMBRANE, METHOD FOR MANUFACTURING NONVOLATILE MEMORY DEVICE USING THE SAME, AND NONVOLATILE MEMORY DEVICE USING THIS METHOD
审中-公开
基本信息:
- 专利标题: APPARATUS FOR FORMING TRANSITION METAL OXIDE MEMBRANE, METHOD FOR MANUFACTURING NONVOLATILE MEMORY DEVICE USING THE SAME, AND NONVOLATILE MEMORY DEVICE USING THIS METHOD
- 专利标题(中):用于形成过渡金属氧化物膜的装置,使用其制造非易失性存储器件的方法和使用该方法的非易失性存储器件
- 申请号:KR20060017243 申请日:2006-02-22
- 公开(公告)号:KR20070084888A 公开(公告)日:2007-08-27
- 发明人: LEE JUNG HYUN , BANG SANG BONG , CHOI SANG JUN , SEO BUM SEOK , LEE CHANG SOO
- 申请人: SAMSUNG ELECTRONICS CO LTD
- 专利权人: SAMSUNG ELECTRONICS CO LTD
- 当前专利权人: SAMSUNG ELECTRONICS CO LTD
- 优先权: KR20060017243 2006-02-22
- 主分类号: H01L21/8247
- IPC分类号: H01L21/8247 ; H01L21/316
摘要:
An apparatus for forming a transition metal oxide layer, a method for manufacturing a nonvolatile memory device using the same, and a nonvolatile memory device manufactured by the same are provided to increase the density of a layer, to have the smoother surface of the layer, and to improve adhesive strength between the layer and a substrate by forming the transition metal oxide layer whose physical and electrical characteristics are improved on the substrate. A substrate(56) is installed in a chamber(51). A transition metal oxide layer(55) is formed on the substrate. A target(58) is installed in the chamber. Transition metal particles(M) that are a first source material of the transition metal oxide layer toward the substrate are discharged from the target. An oxygen ion beam gun(60) accelerates oxygen ions that are a second source material of the transition metal oxide layer to irradiates them toward the substrate. An argon ion beam gun(65) irradiates accelerated argon ions toward the target in order to excite a discharge of the transition metal particles from the target.
摘要(中):
用于形成过渡金属氧化物层的装置,制造使用该过渡金属氧化物层的非易失性存储装置的方法和由其制造的非易失性存储装置被提供以增加层的密度,以使层的更平滑的表面, 并且通过形成在衬底上物理和电学特性得到改善的过渡金属氧化物层来改善层和衬底之间的粘合强度。 衬底(56)安装在腔室(51)中。 在基板上形成过渡金属氧化物层(55)。 目标(58)安装在腔室中。 作为朝向基板的过渡金属氧化物层的第一源极材料的过渡金属粒子(M)从靶材排出。 氧离子束枪(60)加速作为过渡金属氧化物层的第二源材料的氧离子以将其照射到衬底。 氩离子束枪(65)将加速的氩离子照射到靶上,以激发过渡金属颗粒从靶中的排出。
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
------------H01L21/78 | ...把衬底连续地分成多个独立的器件 |
--------------H01L21/782 | ....制造多个器件,每一个由单个电路元件组成 |
----------------H01L21/822 | .....衬底是采用硅工艺的半导体的 |
------------------H01L21/8222 | ......双极工艺 |
--------------------H01L21/8234 | .......MIS工艺 |
----------------------H01L21/8239 | ........存储器结构 |
------------------------H01L21/8246 | .........只读存储器结构(ROM) |
--------------------------H01L21/8247 | ..........电可编程序的 |