基本信息:
- 专利标题： 본딩장치
- 专利标题（英）：Bonding Apparatus
- 专利标题（中）：绑定设备
- 申请号：KR1020020065884 申请日：2002-10-28
- 公开(公告)号：KR1020030038380A 公开(公告)日：2003-05-16
- 发明人： 니시우라신이치 , 오오타카가즈히로
- 申请人： 가부시키가이샤 신가와
- 申请人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 专利权人： 가부시키가이샤 신가와
- 当前专利权人： 가부시키가이샤 신가와
- 当前专利权人地址： *-**-*, Inadaira, Musashimurayama-shi, Tokyo, Japan
- 代理人： 박종혁; 정진상
- 优先权： JPJP-P-2001-00336011 2001-11-01
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
PURPOSE: To inhibit adverse effects in terms of vibration characteristics that a pneumatic pipe exerts on a transducer. CONSTITUTION: As a result of securing the pneumatic pipe 31 for suction to a pipe-mounting part 9 through a connecting member 50 comprising a foamed resin material, the effects of a reaction force from the pneumatic pipe 31 on the ultrasonic vibration of an ultrasonic horn 1 can be inhibited well. This is considered due to the fact that the mass (m) and the coefficient of viscosity (c) of the foamed resin material comprising the connecting member 50 are remarkably small, compared with these values of metal and a non-foamed resin material, so as to inhibit the effects of the reaction force on the ultrasonic vibration with high acceleration (a) and velocity (v), when the reaction force F is defined as: F equals ma plus cv plus kx (m = mass, a = acceleration, c = coefficient of viscosity, v = velocity, k = spring constant and x = displacement).
摘要（中）：
目的：抑制气动管对换能器的振动特性的不利影响。 构成：由于通过包括泡沫树脂材料的连接构件50将气动管31吸引到管道安装部9的结果是来自气动管31的反作用力对超声波喇叭的超声波振动的影响 1可以很好的抑制。 考虑到与金属和非发泡树脂材料相比，包含连接构件50的发泡树脂材料的质量（m）和粘度系数（c）非常小，因此， 为了抑制反作用力对高加速度（a）和速度（v）的超声波振动的影响，当反作用力F定义为：F等于ma加cv加kx（m =质量，a =加速度， c =粘度系数，v =速度，k =弹簧常数，x =位移）。
公开/授权文献:
- KR100510755B1 본딩장치 公开/授权日：2005-08-26
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |