PURPOSE: A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate is provided to simplify significantly a manufacturing process by removing an intermediate processes. CONSTITUTION: A multiplicity of multi-alloy solder columns is attached to an electronic substrate. A mold plate(10) equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate(30) and a transfer plate(40) by utilizing a multiplicity of displacement device equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.