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2. 发明公开

KR1020020017993A 사출 성형된 땜납에 의한 저온 땜납 컬럼 접합 방법 失效
标题翻译：注射成型的低温焊接柱和结构形成
公开(公告)号：KR1020020017993A
公开(公告)日：2002-03-07
申请号：KR1020010051390
申请日：2001-08-24
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 그루버피터에이 , 볼드란니에알 , 로우일렛트구이피 , 코벨제임스에이취 , 다노비치데이비드 , 레이촌씨
IPC分类号： H05K3/34 , B23K31/02
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2201/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： PURPOSE: A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate is provided to simplify significantly a manufacturing process by removing an intermediate processes. CONSTITUTION: A multiplicity of multi-alloy solder columns is attached to an electronic substrate. A mold plate(10) equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate(30) and a transfer plate(40) by utilizing a multiplicity of displacement device equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译：目的：提供将多种多合金焊料柱连接到电子基板的方法，以通过去除中间工艺来显着地简化制造过程。构成：多个多合金焊料柱附着在电子基板上。首先用注射成型的焊接技术填充装配有多个空腔的模板（10），其中形成多个焊料柱的高温焊料。然后通过利用设置在提取板中的多个位移装置将模板夹在提取板（30）和转印板（40）之间，以将多个焊料柱从模板移位成多个孔转印板。传递板中的多个空腔各具有直的开口和扩口的开口。然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

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