基本信息:
- 专利标题: 반도체 패키지 마킹 장치의 사이드 푸셔
- 专利标题(英):Side pusher marking of the semiconductor package device
- 专利标题(中):半导体封装标记装置的侧推器
- 申请号:KR1019960044163 申请日:1996-10-05
- 公开(公告)号:KR1019980025871A 公开(公告)日:1998-07-15
- 发明人: 이규하
- 申请人: 삼성전자주식회사
- 申请人地址: ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人: 삼성전자주식회사
- 当前专利权人: 삼성전자주식회사
- 当前专利权人地址: ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人: 윤동열; 이선희
- 主分类号: H01L23/544
- IPC分类号: H01L23/544
The present invention relates to a side of the semiconductor package pusher marking apparatus, the means for reciprocating motion; The connection means fastened to the reciprocating movement means for the mechanical; A first side pusher for transferring the reciprocating movement is connected to the connection means in the package directions; Said first slide bearing is mechanically fastened to the lower side of the side pusher; A second side fastened to the upper surface of the pusher and of the mechanical side of the slide bearing; Rail base for transporting and supporting a bearing mounting portion, and a semiconductor package formed to be mounted to the slide bearing in sequence; And, the second is installed on the side pusher and the symmetrical position the guide rail for guiding the transfer of the semiconductor package; By providing a pusher side of the semiconductor package the marking apparatus comprising prevent damage to the equipment due to the friction, and to the repair time of the machine reducing it provides the advantage (利 點) to improve quality and productivity improvement.
公开/授权文献:
- KR100188185B1 반도체 패키지 마킹 장치의 사이드 푸셔 公开/授权日:1999-07-01
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/544 | .加到半导体器件上的标志,例如注册商标、测试图案 |