基本信息:
- 专利标题： 반도체 패키지 및 이의 제조 방법
- 专利标题（英）：Semiconductor package and method for manufacturing the same
- 申请号：KR1020160045053 申请日：2016-04-12
- 公开(公告)号：KR101787886B1 公开(公告)日：2017-10-19
- 发明人： 이재웅 , 김병진 , 이영우 , 방동현 , 조은나라
- 申请人： 앰코 테크놀로지 코리아 주식회사
- 申请人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人： 앰코 테크놀로지 코리아 주식회사
- 当前专利权人地址： 광주광역시 북구 앰코로 *** (대촌동)
- 代理人： 서만규; 서경민
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/00 ; H01L21/56 ; H01L23/498 ; H01L25/065 ; H01L25/00 ; H01L23/66
The present invention relates to a system, a package and a method of manufacturing of a new structure having a three-layer structure including molding a plurality of semiconductor chips and the element to be molded and then mounted on the upper and lower surfaces of the molded substrate.
That is, the present invention is by preparing the system in package using a low-cost molded substrate of a conductive metal pattern of the plurality of layers are molded with a molding resin, it is possible to reduce the manufacturing cost of the package system, the top surface of the molded substrate, and by then mounting the semiconductor element on both the lower surface and molded with the mold resin sealing, intended to provide a semiconductor package and a method to reduce the horizontal size of the overall system package.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/538 | ..制作在绝缘衬底上或内的多个半导体芯片间的互连结构 |