基本信息:
- 专利标题： 적층 세라믹 전자부품, 연속 테이핑 전자부품 및 적층 세라믹 전자부품의 제조방법
- 专利标题（英）：Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component
- 专利标题（中）：多层陶瓷电子元件系列存储在磁带中的电子元件和制造多层陶瓷电子元件的方法
- 申请号：KR1020140144403 申请日：2014-10-23
- 公开(公告)号：KR101634598B1 公开(公告)日：2016-06-29
- 发明人： 시미즈코타로
- 申请人： 가부시키가이샤 무라타 세이사쿠쇼
- 申请人地址： **-*, Higashikotari *-chome, Nagaokakyo-shi, Kyoto-fu ***-****, Japan
- 专利权人： 가부시키가이샤 무라타 세이사쿠쇼
- 当前专利权人： 가부시키가이샤 무라타 세이사쿠쇼
- 当前专利权人地址： **-*, Higashikotari *-chome, Nagaokakyo-shi, Kyoto-fu ***-****, Japan
- 代理人： 윤동열
- 优先权： JPJP-P-2013-220932 2013-10-24; JPJP-P-2014-171098 2014-08-26
- 主分类号： H01G4/012
- IPC分类号： H01G4/012 ; H01G4/12 ; H01G4/232 ; H01G4/30 ; H01C1/148 ; H01C7/00 ; H01G13/00 ; H01L41/047 ; H01L41/293
摘要：
실장시에적층세라믹전자부품이손상되는것을억제한다. 제1의주면(10a)에있어서의단차의크기와, 제2의주면(10b)에있어서의단차의크기가다르다. 제1의외부전극(13)은 Cu를포함하는도금막을가진다. Cu를포함하는도금막의제1의주면(10a)상에위치하는부분의길이방향을따른길이와, Cu를포함하는도금막의제2의주면(10b)상에위치하는부분의길이방향을따른길이가다르다.
摘要（英）：
To suppress the multilayer ceramic electronic device is damaged during the mounting.
And size of the step in the first main surface (10a), different from the size of the step in the main surface (10b) of the second. An external electrode 13 of the first has a plated film containing Cu. The main surface of the plating film of claim 1 comprising a Cu (10a) and a length along the longitudinal direction of the portion located on the, length along the longitudinal direction of the portion located on the main surface (10b) of the plating film of claim 2 containing Cu It is different.
公开/授权文献:
- KR1020150047440A 적층 세라믹 전자부품, 연속 테이핑 전자부품 및 적층 세라믹 전자부품의 제조방법 公开/授权日：2015-05-04
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01G | 电容器；电解型的电容器、整流器、检波器、开关器件、光敏器件或热敏器件 |
| ------H01G4/00 | 固定电容器；及其制造方法 |
| --------H01G4/002 | .零部件 |
| ----------H01G4/005 | ..电极 |
| ------------H01G4/012 | ...非自持电极的形成 |