基本信息:
- 专利标题： 칩 온 글라스 본딩 구조체
- 专利标题（英）：Chip on glass structure
- 专利标题（中）：玻璃结构芯片
- 申请号：KR1020140052382 申请日：2014-04-30
- 公开(公告)号：KR101611376B1 公开(公告)日：2016-04-11
- 发明人： 린추-순
- 申请人： 하이맥스 테크놀로지스 리미티드
- 申请人地址： No.**, Zih Lian Road, Fonghua Village, Sinshih Township, Tainan County *****, Taiwan (R.O.C.)
- 专利权人： 하이맥스 테크놀로지스 리미티드
- 当前专利权人： 하이맥스 테크놀로지스 리미티드
- 当前专利权人地址： No.**, Zih Lian Road, Fonghua Village, Sinshih Township, Tainan County *****, Taiwan (R.O.C.)
- 代理人： 유미특허법인
- 优先权： US61/820,152 2013-05-06
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
본발명은금속패드상에위치하는보호층, 금속패드상에위치하고또한일부가보호층상에위치하는점착층, 일부가오목부내에위치하고점착층을커버하는금속범프, 금속범프을완전히커버하는캡핑층, 유리층과직접적으로연결되는리드층, 및캡핑층과리드층을전기적으로연결하는도전성입자층을포함하는칩 온글라스본딩구조체를제공한다.
摘要（中）：
用于驱动器IC的金属凸块结构包括设置在金属焊盘上并在金属焊盘上限定凹陷的钝化层，在所述凹槽中的粘附层，金属焊盘和钝化层上的金属凸块， 所述凹部并且完全覆盖所述粘合层，以及覆盖层，设置在所述金属凸块上并且完全覆盖所述金属凸块，使得所述金属凸块不暴露于环境气氛。
摘要（英）：
The present invention is located on the protective layer, a metal pad located on the metal pad also pressure-sensitive adhesive layer, a capping layer, which portion is located within the recess metal bumps, metal beompeueul completely cover covering the adhesive layer, which portion is located on the protective layer and it provides a chip-on-glass bonding structure comprising a lead layer, and a conductive particle layer for electrically connecting the capping layer and the lead layer is connected to the glass layer directly.
公开/授权文献:
- KR1020140131871A 칩 온 글라스 본딩 구조체 公开/授权日：2014-11-14
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |