基本信息:
- 专利标题： 회로로서 상호접속된 3 단자 인쇄 디바이스
- 专利标题（英）：Three-terminal printed devices interconnected as circuits
- 专利标题（中）：3个三端印刷设备作为电路互连
- 申请号：KR1020157028806 申请日：2014-03-13
- 公开(公告)号：KR101611147B1 公开(公告)日：2016-04-08
- 发明人： 블랜차드리차드오스틴
- 申请人： 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드
- 申请人地址： **** West Auto Drive, Tempe, AZ ***** United States of America
- 专利权人： 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드
- 当前专利权人： 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드
- 当前专利权人地址： **** West Auto Drive, Tempe, AZ ***** United States of America
- 代理人： 제일특허법인
- 优先权： US61/785,357 2013-03-14; US14/204,886 2014-03-11
- 国际申请： PCT/US2014/026127 2014-03-13
- 国际公布： WO2014160239 2014-10-02
- 主分类号： H01L21/84
- IPC分类号： H01L21/84 ; H01L23/00 ; H01L25/065 ; H01L25/07 ; H01L25/075 ; H01L25/00 ; H01L27/12
Fine three-terminal transistor is layer (40, 74) printed over the first conductor layer 52 is in electrical contact with lower electrode (58, 80), the first conductor layer of the transistor. A first dielectric layer 60 has the first conductive covering material layer, a second conductor above the first dielectric layer material layer 62 is in contact with the intermediate electrode 48 on the transistor between the lower electrode and the upper electrode 46 do. A second dielectric layer 64 covering the second conductor layer, the third conductive layer 66 above the second dielectric layer is in contact with the upper electrode. Therefore, the device is electrically connected in parallel by a combination of the first conductor layer, the second conductor layer and the third conductor layer. The individual groups of devices can be interconnected to form a more complex circuit. The final is quite thin flex circuit may be in the circuit.
公开/授权文献:
- KR1020150125723A 회로로서 상호접속된 3 단자 인쇄 디바이스 公开/授权日：2015-11-09
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
| ------------H01L21/78 | ...把衬底连续地分成多个独立的器件 |
| --------------H01L21/782 | ....制造多个器件，每一个由单个电路元件组成 |
| ----------------H01L21/84 | .....衬底不是半导体的，例如绝缘体 |