基本信息:
- 专利标题： 반도체 패키지 모듈
- 专利标题（英）：Semiconductor package module
- 专利标题（中）：半导体封装模块
- 申请号：KR1020120068102 申请日：2012-06-25
- 公开(公告)号：KR101388779B1 公开(公告)日：2014-04-25
- 发明人： 김광수 , 이영기 , 서범석
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
The present invention relates to a semiconductor package module, and more particularly, to have a modularity of the power semiconductor device is difficult because of the integrated heat generation semiconductor package module. The semiconductor package module according to the invention To this end, a number of the semiconductor package; And the inner tube shape forming a flow path, the heat radiation member having at least one through-hole of the semiconductor package to be inserted; includes the semiconductor package are cross section is formed in a rectangular shape in a number dog side by side in the radiation member being inserted into place, and the heat radiation member is formed into a shape protruding in the flow path includes at least one protrusion for inducing the flow of the refrigerant flowing in the flow path toward the semiconductor package, the projecting portion is adjacent in the flow path may be formed in the space between the through-holes are arranged.
公开/授权文献:
- KR1020140017031A 반도체 패키지 모듈 公开/授权日：2014-02-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |