基本信息:
- 专利标题: 광전자 및 전자 소자에 사용하기에 적합한 복합 필름
- 专利标题(英):Composite films suitable for use in opto-electronic and electronic devices
- 专利标题(中):适用于光电和电子设备的复合膜
- 申请号:KR1020137014307 申请日:2006-03-16
- 公开(公告)号:KR101367540B1 公开(公告)日:2014-02-25
- 发明人: 맥도날드,윌리엄,알레스데어 , 플라시도,프랭크 , 이브슨,로버트,윌리엄
- 申请人: 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽
- 申请人地址: Chestnut Run Plaza ***, *** Centre Road, P.O. Box ****, Wilmington, Delaware *****, U.S.A.
- 专利权人: 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽
- 当前专利权人: 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽
- 当前专利权人地址: Chestnut Run Plaza ***, *** Centre Road, P.O. Box ****, Wilmington, Delaware *****, U.S.A.
- 代理人: 양영준; 김영
- 优先权: GB05055173 2005-03-17
- 国际申请: PCT/GB2006/000946 2006-03-16
- 国际公布: WO2006097733 2006-09-21
- 主分类号: H01L51/00
- IPC分类号: H01L51/00 ; H01L51/56
(I) forming a polymeric substrate layer; (Ii) step of stretching the substrate layer in one or more directions; (Iii) determining the substrate stage higher than the glass transition temperature of the polymer layer under the opening in its lower melting temperature than the temperature of the film to the tension per 1 m wide range of about 19 to about 75 kg dimensions constraints; (Iv) higher than the glass transition temperature of the base polymer layer step of heat stabilizing the film at a temperature lower than their melting temperature; (V) the surface of the substrate with a planarizing coating a coating composition comprising: applying to exhibit Rq values of the Ra value and / or less than 0.8 nm is less than 0.6 nm; (Vi) providing an inorganic barrier layer of thickness from 2 to 1000 nm by a high energy deposition; And optionally, (vii) production method and manufacturing method of electronic or opto-electronic device of the composite film comprising the step of providing the composite film comprising said polymeric substrate layer, said planarization layer and said inorganic barrier layer as described in the electronic or optoelectronic device , and is provided with the composite film and the electronic or optoelectronic device.
公开/授权文献:
- KR1020130086058A 광전자 및 전자 소자에 사용하기에 적합한 복합 필름 公开/授权日:2013-07-30