基本信息:
- 专利标题： 방열 입자, 그 제조 방법 및 이를 포함하는 전자부품 패키징용 접착제 조성물
- 专利标题（英）：A particle having heat radiation property, method for manufacture thereof, and adhesive composition for packaging electronic components
- 专利标题（中）：具有散热性的颗粒，其制造方法和用于包装电子部件的粘合剂组合物
- 申请号：KR1020110114604 申请日：2011-11-04
- 公开(公告)号：KR101303229B1 公开(公告)日：2013-09-04
- 发明人： 김주헌 , 임현구 , 김지원
- 申请人： 중앙대학교 산학협력단
- 申请人地址： 서울 동작구 흑석동 ***
- 专利权人： 중앙대학교 산학협력단
- 当前专利权人： 중앙대학교 산학협력단
- 当前专利权人地址： 서울 동작구 흑석동 ***
- 代理人： 특허법인다나
- 主分类号： C09K5/14
- IPC分类号： C09K5/14 ; C09J163/00 ; C09J175/00
The invention particle radiation, its manufacturing method, a glue for packaging electronic parts and heat-radiating material composition comprising the same. Radiation are carbon-based base material particle of the present invention; And it comprises at least one coating layer is selected from the group consisting of a mixed layer of a metal hydroxide layer, a metal oxide layer and the metal hydroxide and the metal oxide formed on the surface of the carbon-based material, retained castle high thermal conductivity of the carbon-based material, while the insulating It may have. In addition, the electronic component packaging an adhesive composition of the present invention is a resin for adhesion; A thermally conductive filler; And it includes a heat radiating particle in accordance with the present invention, by the heat-dissipating particles have insulating properties is formed in the maintenance while the thermally conductive path connecting between the in the adhesive composition of the thermally conductive filler in the invention, it is possible to further improve a heat radiation effect.
公开/授权文献:
- KR1020130049520A 방열 입자, 그 제조 방법 및 이를 포함하는 전자부품 패키징용 접착제 조성물 公开/授权日：2013-05-14