基本信息:
- 专利标题： 사파이어 잉곳 가공용 지그
- 专利标题（英）：Jig for processing sapphire ingot
- 专利标题（中）：加工蓝宝石锭的夹具
- 申请号：KR1020110077593 申请日：2011-08-04
- 公开(公告)号：KR101289660B1 公开(公告)日：2013-07-25
- 发明人： 박종인 , 오응세 , 이종찬
- 申请人： 주식회사 케이엠에이치하이텍 , 비아이신소재 주식회사
- 申请人地址： 충청남도 아산시 음봉면 연암율금로 ***
- 专利权人： 주식회사 케이엠에이치하이텍,비아이신소재 주식회사
- 当前专利权人： 주식회사 케이엠에이치하이텍,비아이신소재 주식회사
- 当前专利权人地址： 충청남도 아산시 음봉면 연암율금로 ***
- 代理人： 조영현; 나승택
- 主分类号： B28D5/00
- IPC分类号： B28D5/00 ; B28D7/04 ; C30B29/20
이에 의하여 사파이어 잉곳의 c축이 기울어진 정도를 보정하여 가공할 수 있는 사파이어 잉곳 가공용 지그가 제공된다.
The present invention relates to a machining jig sapphire ingot, sapphire ingot machining jig according to the invention the mounting section is mounted member which is provided sapphire ingot is seated; A base portion for supporting the mounting portion is disposed on the lower parts of the mounting; Is inserted in the through-hole gongyi formed tilting plate, respectively through the two sides side which engage with and adjacent to the lower parts of the mounting fastened to the position corresponding to the base portion of the through ball and the said tilting plate so inclined that the tilting plate tilting axis to move toward or away from the direction of approaching the base part, is coupled to the tilting axis, an outer peripheral surface provided with a tilting unit for tilting the fixing member for fixing the tilting axis such that the binary state of the base portion inclined maintained; The base portion and the spacer member in contact with the mounting portion said mounting portion is interposed between that end face is inclined provided with circular ring-shaped, having an elastic member for applying an elastic force in a direction closer to the base portion in the tilting plate characterized by including a; separated portion.
Whereby the sapphire ingot processing jig that can be processed by correcting the degree of c-axis sapphire ingot is provided by tilted.
公开/授权文献:
- KR1020130015549A 사파이어 잉곳 가공용 지그 公开/授权日：2013-02-14
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B28 | 加工水泥、黏土或石料 |
| ----B28D | 加工石头或类似石头的材料 |
| ------B28D5/00 | 宝石、宝石饰物、结晶体的精细加工，例如半导体材料的精加工；所用设备 |