基本信息:
- 专利标题： 인쇄 회로 기판용 절연성 수지 조성물 및 이를 포함하는 인쇄 회로 기판
- 专利标题（英）：Insulating resin composition for printed circuit board and printed circuit board comprising the same
- 专利标题（中）：用于印刷电路板的绝缘树脂组合物和包含该绝缘树脂组合物的印刷电路板
- 申请号：KR1020110052280 申请日：2011-05-31
- 公开(公告)号：KR101275396B1 公开(公告)日：2013-06-17
- 发明人： 윤금희 , 이정규 , 이현준 , 김진영 , 김진철
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： C08L65/00
- IPC分类号： C08L65/00 ; C08L63/00 ; H01B3/30 ; H05K1/03
The invention printing relates to a printed circuit board circuit insulating resin composition and the circuit board including the same, an exemplary printed circuit board insulating resin composition according to the form of the liquid crystal oligomer, 20 to 40 parts by weight represented by the specific formula of the invention , it includes an epoxy resin 20 to 40 parts by weight and 0.1 to 0.5 parts by weight of a curing catalyst. According to an aspect of the invention, the printed circuit board can be secured a screen, low-weight, compact and thinned even if the printed circuit electrical, thermal and mechanical stability of the substrate. In addition, existing in the substrate refers to the stabilized operating characteristics, at the same time as the adhesive strength represents a low dielectric constant process, may be excellent in chemical resistance and bending properties.
公开/授权文献:
- KR1020120133569A 인쇄 회로 기판용 절연성 수지 조성물 및 이를 포함하는 인쇄 회로 기판 公开/授权日：2012-12-11
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L65/00 | 由主链中形成碳—碳键反应得到的高分子化合物的组合物；此种聚合物的衍生物的组合物 |