基本信息:
- 专利标题： 반도체 발광 소자의 실장 방법과 실장 장치
- 专利标题（英）：Method and apparatus for mounting semiconductor light emitting element
- 专利标题（中）：用于安装半导体发光元件的方法和装置
- 申请号：KR1020117027802 申请日：2011-04-26
- 公开(公告)号：KR101258394B1 公开(公告)日：2013-04-30
- 发明人： 이토도모노리 , 도요다가오리 , 이케우치히로키 , 가와바타다케시
- 申请人： 파나소닉 주식회사
- 申请人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 专利权人： 파나소닉 주식회사
- 当前专利权人： 파나소닉 주식회사
- 当前专利权人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 代理人： 한양특허법인
- 优先权： JPJP-P-2010-114834 2010-05-19
- 国际申请： PCT/JP2011/002431 2011-04-26
- 国际公布： WO2011145278 2011-11-24
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L21/60
Electrode portion of the semiconductor light emitting element (2) of the bump electrode 26 and the mounting board (3) according to the bonding electrode 21 of the bump electrodes 26 of the semiconductor light emitting element 2 and the mounting board (3) and emitting supplying electric power to the electrode portion 21 of the mounting board (3) when the junction (21) to a semiconductor light emitting device (2) as its power, and detecting the optical characteristics of the light-emitting semiconductor light-emitting element (2) , since the process detects the optical characteristics value to acquire a bonding state of the electrode 21 of the semiconductor light emitting element (2) of the bump electrode 26 and the mounting board (3) determine the bonding is completed, the semiconductor light emitting device that through a metal electrode formed on the can be satisfactorily bonded to the electrode portion on the mounting board.
公开/授权文献:
- KR1020120034625A 반도체 발광 소자의 실장 방법과 실장 장치 公开/授权日：2012-04-12