基本信息:
- 专利标题： 반도체 발광 소자의 실장 방법과 실장 장치
- 专利标题（英）：Method and apparatus for mounting semiconductor light emitting element
- 专利标题（中）：用于安装半导体发光元件的方法和装置
- 申请号：KR1020117027802 申请日：2011-04-26
- 公开(公告)号：KR1020120034625A 公开(公告)日：2012-04-12
- 发明人： 이토도모노리 , 도요다가오리 , 이케우치히로키 , 가와바타다케시
- 申请人： 파나소닉 주식회사
- 申请人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 专利权人： 파나소닉 주식회사
- 当前专利权人： 파나소닉 주식회사
- 当前专利权人地址： ****, Oaza Kadoma, Kadoma-shi, Osaka, Japan
- 代理人： 한양특허법인
- 优先权： JPJP-P-2010-114834 2010-05-19
- 国际申请： PCT/JP2011/002431 2011-04-26
- 国际公布： WO2011145278 2011-11-24
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L21/60
摘要：
When bump electrodes 26 of a semiconductor light emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light emitting element 2 to emit light, the optical properties of the semiconductor light emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light emitting element.
公开/授权文献:
- KR101258394B1 반도체 발광 소자의 실장 방법과 실장 장치 公开/授权日：2013-04-30