基本信息:
- 专利标题: 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법
- 专利标题(英):High strength and High electric conductive multi-layer copper sheets and manufacturing method of the same
- 专利标题(中):高强度高导电多层铜板及其制造方法相同
- 申请号:KR1020110002941 申请日:2011-01-12
- 公开(公告)号:KR101227014B1 公开(公告)日:2013-01-28
- 发明人: 김형욱 , 임차용
- 申请人: 한국기계연구원
- 申请人地址: 대전광역시 유성구 가정북로 *** (장동)
- 专利权人: 한국기계연구원
- 当前专利权人: 한국기계연구원
- 当前专利权人地址: 대전광역시 유성구 가정북로 *** (장동)
- 代理人: 이성재
- 主分类号: B23K20/04
- IPC分类号: B23K20/04
High-strength high electrical conductivity nanocrystalline multilayer copper alloy sheet material according to the invention, OFC (Oxygen Free Copper) repeatedly, the alloy and DLP (Deoxidized Low-Phosphorous copper) alloy rolled joint (Roll-Bonding) to 85IACS (%) or more of electrical conductivity and It characterized by having a tensile strength of at least 400㎫. Method of manufacturing a high-strength high electrical conductivity nanocrystalline multilayer copper alloy sheet material according to the invention, OFC (Oxygen Free Copper) processing the material preparation step, and the plate material to prepare a plate material made of an alloy with DLP (Deoxidized Low-Phosphorous copper) alloy surface a surface treatment step, and the plate member repeatedly rolling joint (Roll-bonding) to 85IACS (%) consisting of at least the electrical conductivity and the plate member molding step of molding a high-strength high electrical conductivity of the multi-layer nanocrystalline copper alloy sheet has a tensile strength of at least 400㎫ that and that is characterized.
公开/授权文献:
- KR1020120081688A 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 公开/授权日:2012-07-20