One embodiment of the invention relates to a clamp of the plasma cleaning device, a technical problem to be solved in the case of the printed circuit board the bag portion sealing the pressure means coupled to both ends of the printed circuit board so that the compression spring penetrates therein giving pressing simultaneously clamped with the use, it can maintain the printed circuit board in the horizontal, and further a solder ball and a lower portion of the space burning (burning), and damage to the solder ball to minimize the bottom surface of the printed circuit board there used to avoid the combination.
In one clamp of the plasma cleaning apparatus embodiment, clamping the printed circuit board in the plasma cleaning chamber of the invention To this end, the lower surface of the printed circuit board is attached to a plurality of solder balls (solider ball) at a predetermined interval, and , the printed circuit board this recess the bottom plate is formed a number, it is spaced apart in the seating groove on both sides of the guide groove portions are formed each of which is secured to the central portion; A compression spring installed vertically on the guide groove; And coupled to said compression spring through on the guide groove, the pressing means for clamping the both ends of the printed circuit board; includes, the printed circuit board is an upper portion of the pressing means in a sliding state to the pressing means by giving to the pressing by pressing the both ends of the printed circuit board, it discloses a clamp of the plasma-cleaning device that can maintain the printed circuit board horizontally.