基本信息:
- 专利标题： 금속회로기판
- 专利标题（英）：Metal electric circuit
- 专利标题（中）：金属电路
- 申请号：KR1020070053047 申请日：2007-05-31
- 公开(公告)号：KR100913309B1 公开(公告)日：2009-08-26
- 发明人： 김광엽 , 김배연
- 申请人： (주)엠에스티테크놀로지
- 申请人地址： 인천광역시 계양구 아나지로 ***-**(작전동)
- 专利权人： (주)엠에스티테크놀로지
- 当前专利权人： (주)엠에스티테크놀로지
- 当前专利权人地址： 인천광역시 계양구 아나지로 ***-**(작전동)
- 代理人： 천태용
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
이에 의해, 우수한 방열효과를 나타내며, 상기 금속기판과 산화 피막이 형성된 상기 절연층이 상호 분리되지 않으며, 절연층이 갈라지는 현상을 방지할 수 있다.
The present invention relates to a metal circuit board, the metal is formed of a thermally conductive material excellent metal substrate; And an insulating layer formed of the insulating ceramic to the surface of the metal substrate; A circuit layer formed of a metal material of the conductive to the top of the insulating layer, according to a circuit board comprising the said insulating layer is a metal has been generated by applying power to the electrolyte solution, the plasma react with the metal substrate surface of the substrate characterized in that the dielectric consisting of a metal oxide film formed on. As a result, represents a superior heat radiating effect, it is not the metal substrate and the insulating oxide film layer formed separated from each other, it can be prevented cracking the insulating layer.
公开/授权文献:
- KR1020080105451A 금속회로기판 公开/授权日：2008-12-04
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |