A semiconductor device includes a base body (10), a semiconductor chip (40) deposited on a top surface of the base body (10), an encapsulating resin (80) covering the semiconductor chip (40), a ring-shaped plug (70) buried in a part of an upper part of the encapsulating resin (80) and having a top surface exposed to the outside of the encapsulating resin (80), and stand-up terminals (61) each including a vertical part penetrating the ring-shaped plug (70) and extending in a direction perpendicular to the top surface of the base body (10), and having a lower end electrically connected to an electrode of the semiconductor chip (40) inside the encapsulating resin (80) and an upper end exposed to the outside of the encapsulating resin (80), the ring-shaped plug (70) being fixed and bonded to a circumference of a side surface of the vertical parts of the stand-up terminals (61).