基本信息:
- 专利标题: 機能素子内蔵基板
- 专利标题(英):Function element built-in substrate
- 申请号:JP2012505543 申请日:2011-01-19
- 公开(公告)号:JPWO2011114766A1 公开(公告)日:2013-06-27
- 发明人: 大輔 大島 , 大輔 大島 , 菊池 克 , 克 菊池 , 中島 嘉樹 , 嘉樹 中島 , 森 健太郎 , 健太郎 森 , 山道 新太郎 , 新太郎 山道
- 申请人: 日本電気株式会社
- 专利权人: 日本電気株式会社
- 当前专利权人: 日本電気株式会社
- 优先权: JP2010059316 2010-03-16
- 主分类号: H05K3/46
- IPC分类号: H05K3/46
The present invention aims to provide a functional device embedded substrate can suppress the occurrence of possible and warp thinner.
The present invention includes at least a functional element having an electrode terminal, a functional device embedded substrate comprising a covering insulating layer, a coating at least the electrode terminals and side surfaces of the functional element,
Inside the cover insulating layer a periphery of the functional element has a first columnar structure made of a material having a thermal expansion coefficient between the insulating cover layer and the functional element,
Columnar structures wherein the first functional element built, wherein a shortest distance from the side face of the functional element to the side surface of the first columnar structure is disposed to a thickness less than the position of the functional element it is a substrate.
公开/授权文献:
- JP5692217B2 機能素子内蔵基板 公开/授权日:2015-04-01
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/46 | .多层电路的制造 |