基本信息:
- 专利标题： リン含有活性エステル、硬化性樹脂組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材、及び、半導体装置
- 专利标题（英）：PHOSPHOROUS-CONTAINING ACTIVE ESTER, CURABLE RESIN COMPOSITION, CURED MATERIAL, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALANT, AND SEMICONDUCTOR DEVICE
- 申请号：JP2020106233 申请日：2020-06-19
- 公开(公告)号：JP2022001612A 公开(公告)日：2022-01-06
- 发明人： キム ヨンチャン , 迫 雅樹 , 林 弘司
- 申请人： DIC株式会社
- 申请人地址： 東京都板橋区坂下3丁目35番58号
- 专利权人： DIC株式会社
- 当前专利权人： DIC株式会社
- 当前专利权人地址： 東京都板橋区坂下3丁目35番58号
- 代理人： 特許業務法人 ユニアス国際特許事務所
- 主分类号： C08G59/40
- IPC分类号： C08G59/40 ; C08J5/24 ; B32B27/36 ; C08G63/692
To provide a phosphorous-containing active ester capable of developing excellent fire retardancy, low dielectric property, and adhesiveness in an obtained cured material, a curable resin composition containing the phosphorous-containing active ester, and a cured material obtained by using the curable resin composition, furthermore, a semiconductor sealant using the curable resin composition, a semiconductor device, a prepreg, a circuit board, and a build-up film.SOLUTION: The present invention relates to a phosphorous-containing active ester characterized by having a structure in which a residue (A) of a phosphorous-containing polyvalent alcohol compound and a residual (Q) of aromatic polyvalent carboxylic acid are bonded via an ester bond, and a terminal is sealed by a residual (C) of a monovalent aromatic hydroxyl group-containing compound.SELECTED DRAWING: None