基本信息:
- 专利标题: 弾性波装置、弾性波装置パッケージ及びマルチプレクサ
- 专利标题(英):ACOUSTIC WAVE DEVICE, ACOUSTIC WAVE DEVICE PACKAGE, AND MULTIPLEXER
- 申请号:JP2021133053 申请日:2021-08-18
- 公开(公告)号:JP2021192523A 公开(公告)日:2021-12-16
- 发明人: 岩本 英樹
- 申请人: 株式会社村田製作所
- 申请人地址: 京都府長岡京市東神足1丁目10番1号
- 专利权人: 株式会社村田製作所
- 当前专利权人: 株式会社村田製作所
- 当前专利权人地址: 京都府長岡京市東神足1丁目10番1号
- 代理人: 特許業務法人 宮▲崎▼・目次特許事務所
- 优先权: JP2017044687 2017-03-09
- 主分类号: H03H9/72
- IPC分类号: H03H9/72 ; H01L23/08 ; H03H9/25
To provide acoustic wave devices in each of which the frequency positions of higher modes that propagate in a support substrate made of silicon hardly vary.SOLUTION: An acoustic wave device 1 includes: a support substrate 2 made of silicon; a piezoelectric body 4 provided directly or indirectly on the support substrate 2, the piezoelectric body including a pair of main surfaces facing each other; and an IDT electrode 5 provided directly or indirectly on at least one of the main surfaces of the piezoelectric body 4, where a wave length that is determined by an electrode finger pitch of the IDT electrode being λ. An acoustic velocity VSi in the following expression (1) of bulk waves that propagate in the support substrate 2 is higher than or equal to 5,500 m/s, the acoustic velocity being determined by V1 out of solutions V1, V2, V3 of x derived from the following expression (2). VSi=(V1)1/2...expression (1) Ax3+Bx2+Cx+D=0...expression (2)SELECTED DRAWING: Figure 1
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H03 | 基本电子电路 |
----H03H | 阻抗网络,例如谐振电路;谐振器 |
------H03H9/00 | 包括机电或电声元件的网络,如谐振电路 |
--------H03H9/30 | .时延网络 |
----------H03H9/72 | ..应用声表面波的网络 |