基本信息:
- 专利标题： 導電性粒子、その製造方法及びそれを含む導電性材料
- 专利标题（英）：CONDUCTIVE PARTICLE, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE MATERIAL CONTAINING THE SAME
- 申请号：JP2020067330 申请日：2020-04-03
- 公开(公告)号：JP2021163717A 公开(公告)日：2021-10-11
- 发明人： 稲葉 裕之
- 申请人： 日本化学工業株式会社
- 申请人地址： 東京都江東区亀戸9丁目11番1号
- 专利权人： 日本化学工業株式会社
- 当前专利权人： 日本化学工業株式会社
- 当前专利权人地址： 東京都江東区亀戸9丁目11番1号
- 代理人： 特許業務法人翔和国際特許事務所
- 主分类号： H01B13/00
- IPC分类号： H01B13/00 ; H01B5/16 ; H01R11/01 ; H01R43/00 ; C23C18/20 ; C23C18/31 ; H01B5/00
To provide a conductive particle that has a better adhesion between a core material particle and a conductive layer than before and has desired characteristics, without the hydrophilization treatment of core material particle affecting the hardness of the conductive particle.SOLUTION: Provided is a conductive particle that has a conductive layer formed on the surface of a core material particle in which a manganese compound is present on the surface and the surface is hydrophilic, and in which the core material particle contains a manganese compound due to the hydrophilization treatment, the rate of decrease in compressive hardness at a compression ratio of 50% due to the hydrophilization treatment of the core material particle is within 10%, and the Rsp value of the core material particle measured using the pulse NMR particle interface characteristic evaluation device is 0.1 or more and 1.5 or less.SELECTED DRAWING: Figure 1
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01B | 电缆；导体；绝缘体；导电、绝缘或介电材料的选择 |
| ------H01B13/00 | 制造导体或电缆制造的专用设备或方法 |