基本信息:
- 专利标题： 半導体素子および固体撮像装置
- 专利标题（英）：SEMICONDUCTOR DEVICE AND SOLID STATE IMAGE PICKUP DEVICE
- 申请号：JP2020052672 申请日：2020-03-24
- 公开(公告)号：JP2021153102A 公开(公告)日：2021-09-30
- 发明人： 糸井 清一 , 櫻井 大輔
- 申请人： パナソニックIPマネジメント株式会社
- 申请人地址： 大阪府大阪市中央区城見2丁目1番61号
- 专利权人： パナソニックIPマネジメント株式会社
- 当前专利权人： パナソニックIPマネジメント株式会社
- 当前专利权人地址： 大阪府大阪市中央区城見2丁目1番61号
- 代理人： 特許業務法人鷲田国際特許事務所
- 主分类号： H04N5/369
- IPC分类号： H04N5/369 ; H01L27/146 ; H01L27/144
To provide a semiconductor device and a solid state image pickup device capable of detecting defects that cause succeeding defects before providing them to a user.SOLUTION: A semiconductor device has a plurality of microlenses provided on the main surface to focus light, a plurality of conductive electrodes provided on the back surface of the main surface, a photoelectric conversion unit to which light focused by microlenses is guided, and a strain sensor provided on the same layer as the photoelectric conversion unit to detect strain. The solid state image pickup device has the semiconductor device, a transparent member, an adhesive layer covering the plurality of microlenses and bonding the transparent member, and a plurality of external connection electrodes electrically connected to each of the conductive electrodes.SELECTED DRAWING: Figure 3