基本信息:
- 专利标题: レーザ加工装置
- 专利标题(英):LASER PROCESSING DEVICE
- 申请号:JP2019236653 申请日:2019-12-26
- 公开(公告)号:JP2021104525A 公开(公告)日:2021-07-26
- 发明人: 小野田 純也
- 申请人: 株式会社キーエンス
- 申请人地址: 大阪府大阪市東淀川区東中島1丁目3番14号
- 专利权人: 株式会社キーエンス
- 当前专利权人: 株式会社キーエンス
- 当前专利权人地址: 大阪府大阪市東淀川区東中島1丁目3番14号
- 代理人: 特許業務法人前田特許事務所
- 主分类号: B23K26/03
- IPC分类号: B23K26/03
To provide a laser processing device configured so that workloads in arranging a processing block are reduced and eventually usability of the device can be improved.SOLUTION: A laser processing device L comprises: a coaxial camera 6 that has an imaging optical axis A1 branching from a laser optical path P and generates a coaxial image Pw1; a display part 801 that has a first display region 801a in which the coaxial image Pw1 is displayed and displays a printing block B in the first display region 801a so that the block is superimposed with the coaxial image Pw1; a printing block moving part 108d that moves a position of the printing block B with respect to the coaxial image Pw1 in the first display region 801a; and a control part 101 that controls a laser scanning part 4 so that the coaxial image Pw1 is renewed in response to movements of the printing block B by the printing block moving part 108d.SELECTED DRAWING: Figure 14
信息查询:
EspacenetIPC结构图谱:
B | 作业;运输 |
--B23 | 机床;不包含在其他类目中的金属加工 |
----B23K | 钎焊或脱焊;焊接;用钎焊或焊接方法包覆或镀敷;局部加热切割,如火焰切割;用激光束加工 |
------B23K26/00 | 用激光束加工,例如焊接,切割,打孔 |
--------B23K26/02 | .工件的定位和观测,如相对于冲击点,激光束的对正,瞄准或聚焦 |
----------B23K26/03 | ..工件的观测 |