基本信息:
- 专利标题： 純ギ酸ガス供給装置、純ギ酸ガスが供給されるはんだ付けシステム及び純ギ酸ガス供給方法
- 专利标题（英）：PURE FORMIC ACID GAS SUPPLYING DEVICE, PURE-FORMIC-ACID-GAS-SUPPLIED SOLDERING SYSTEM, AND METHOD FOR SUPPLYING PURE FORMIC ACID GAS
- 申请号：JP2020003147 申请日：2020-01-10
- 公开(公告)号：JP2021030216A 公开(公告)日：2021-03-01
- 发明人： 葉 國良 , 彭 榮貴 , 陳 瑜濤 , 黄 文鼎 , 黄 正尚
- 申请人： 廣化科技股▲分▼有限公司
- 申请人地址： 台灣新竹縣新豐郷康樂路1段169之2號3樓
- 专利权人： 廣化科技股▲分▼有限公司
- 当前专利权人： 廣化科技股▲分▼有限公司
- 当前专利权人地址： 台灣新竹縣新豐郷康樂路1段169之2號3樓
- 代理人： 寺薗 健一; 河部 大輔
- 优先权： TW108130336 2019-08-23
- 主分类号： B23K1/008
- IPC分类号： B23K1/008 ; B23K1/20 ; B23K31/02 ; B01J4/00 ; B01J7/02
To provide a pure formic acid gas supplying device which can raise the partial pressure and reactivity of formic acid gas and reduce consumption of formic acid gas, a soldering system using the device, and a method for supplying pure formic acid gas.SOLUTION: A pure formic acid gas supplying device 10 comprises a tank 11, a liquid pipeline 12, a heating assembly, a liquid level sensing assembly, and at least one gas pipeline 16. The tank 11 has a sealed inner space. The liquid pipeline 12 communicates with the inner space and is adapted to feed in liquid formic acid. The heating assembly is connected to the tank 11 and heats the liquid formic acid to evaporate it. The liquid level sensing assembly is mounted inside the tank 11 and detects a liquid level of the liquid formic acid. The gas pipeline 16 is connected to the tank 11 and communicates with the inner space at a position higher than the liquid level and is adapted to discharge pure formic acid gas. Such a configuration raises a partial pressure and a reactivity of the pure formic acid gas, and improves the soldering effect and the solder joint strength of the soldering system.SELECTED DRAWING: Figure 1
公开/授权文献:
- JP6963639B2 純ギ酸ガスが供給されるはんだ付けシステム 公开/授权日：2021-11-10
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K1/00 | 钎焊，如硬钎焊或脱焊 |
| --------B23K1/008 | .在炉中钎焊 |