The present invention relates to a manufacturing method of an organic device, comprising the following steps. (I) the step of providing a substrate (1) having a surface provided with electrical contact structure (4) and the insulating portion (3). (Ii) step of the first temporary protective layer (9), provided on some or all of the electrical contact structure (4). (Iii) that the first surface modification layer (6) disposed on the insulating part (3), and / or the third surface modifying layer (10), is not protected in step (ii) the electric the step of providing on the contact structure (4). (Iv) the first step to remove the temporary protective layer (9). (V) a second surface modification layer (5) is provided on the protective electrical contact structure in step (ii) step. (Vi) the first surface modification layer (6), unless provided in step (iii), provided on the insulating portion (3) step. The (vii) an organic semiconductor layer (7), over at least a portion of said first surface modifying layer (6), and on the second surface modifying layer (5), and, if present , provided on said third surface modifying layer (10), thereby obtaining the organic device.