PROBLEM TO BE SOLVED: To enable stacking a plurality of stacked chip packages and electrically connecting them to each other by a simple structure, thereby providing a package including the desired number of semiconductor chips at a low cost.SOLUTION: A stacked chip package 1S comprises a main body 2. The main body 2 includes a main portion 2M, and a plurality of first terminals 4 and second terminals 5 disposed on the top surface and the bottom surface of the main portion 2M. The main portion 2M includes two layered portions 10S1 and 10S2, and a plurality of through electrodes T penetrating through the layered portions. The plurality of through electrodes T are electrically connected to the plurality of terminals 4 and 5. Each of the layered portions includes a semiconductor chip having a first surface and a second surface, and a plurality of surface electrodes. The layered portions 10S1 and 10S2 are bonded such that their second surfaces are facing each other. The terminals 4 are constituted using the surface electrodes of the layered portion 10S1, whereas the terminals 5 are constituted using the surface electrodes of the layered portion 10S2.