发明专利
JP2010278347A Method for manufacturing vertical resonance type surface emission semiconductor laser
审中-公开
基本信息:
- 专利标题: Method for manufacturing vertical resonance type surface emission semiconductor laser
- 专利标题(中):制造垂直共振型表面发射半导体激光的方法
- 申请号:JP2009131015 申请日:2009-05-29
- 公开(公告)号:JP2010278347A 公开(公告)日:2010-12-09
- 发明人: SAGA NORIHIRO , ONISHI YUTAKA
- 申请人: Sumitomo Electric Ind Ltd , 住友電気工業株式会社
- 专利权人: Sumitomo Electric Ind Ltd,住友電気工業株式会社
- 当前专利权人: Sumitomo Electric Ind Ltd,住友電気工業株式会社
- 优先权: JP2009131015 2009-05-29
- 主分类号: H01S5/183
- IPC分类号: H01S5/183 ; H01S5/327
摘要:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a vertical resonance type surface emission semiconductor laser for providing satisfactory emission characteristics without deteriorating characteristics of tunnel junction. SOLUTION: A first distribution bragg reflector 13 is manufactured on the main surface 11a of a semiconductor substrate 11. A first n-type spacer semiconductor layer 15, an active layer 17, and a p-type spacer layer 19 are grown on the first distribution bragg reflector (DBR) 13. Then, a raw material gas and a carbon dopant are supplied to a growth furnace 10, and a p-type high-concentration semiconductor layer 21 for tunnel unction is grown on the p-type spacer semiconductor layer 19. After a p-type high-concentration semiconductor layer 21 is grown, the heat treatment 25 of the p-type high-concentration semiconductor layer 21 is carried out. After the heat treatment 25 is carried out, the raw material gas and the n-type dopant is supplied to the growth furnace 10, and the n-type concentration semiconductor layer 27 for tunnel junction is grown. A heat treatment temperature T TH is within a range of 500 to 600°C. COPYRIGHT: (C)2011,JPO&INPIT
摘要(中):
解决的问题:提供一种制造垂直共振型面发射半导体激光器的方法,用于提供令人满意的发射特性,而不会恶化隧道结的特性。 解决方案:在半导体基板11的主表面11a上制造第一分布布拉格反射器13.第一n型间隔物半导体层15,有源层17和p型间隔层19生长在 第一分配布拉格反射器(DBR)13。然后,将原料气体和碳掺杂剂供给到生长炉10,并且在p型间隔物上生长用于隧道开放的p型高浓度半导体层21 半导体层19.在生长p型高浓度半导体层21之后,进行p型高浓度半导体层21的热处理25。 在进行热处理25之后,将原料气体和n型掺杂剂供给到生长炉10,生长隧道结的n型浓度半导体层27。 热处理温度T TH SB>在500〜600℃的范围内。 版权所有(C)2011,JPO&INPIT