发明专利
JP2010177275A Substrate holding member, substrate treatment method, and method of cleaning the substrate holding member
审中-公开
基本信息:
- 专利标题： Substrate holding member, substrate treatment method, and method of cleaning the substrate holding member
- 专利标题（中）：基板保持部件，基板处理方法以及清洗基板保持部件的方法
- 申请号：JP2009015648 申请日：2009-01-27
- 公开(公告)号：JP2010177275A 公开(公告)日：2010-08-12
- 发明人： OHIRA JUN , HOSOI KAZUTO
- 申请人： Canon Inc , キヤノン株式会社
- 专利权人： Canon Inc,キヤノン株式会社
- 当前专利权人： Canon Inc,キヤノン株式会社
- 优先权： JP2009015648 2009-01-27
- 主分类号： H01L21/205
- IPC分类号： H01L21/205 ; C23C16/44 ; C23C16/458 ; H01L21/304 ; H01L21/3065
摘要：
PROBLEM TO BE SOLVED: To provide: a substrate holding member suppressing generation of a spherical projection, and reducing cost by improving quality and the non-defective ratio of a product; a substrate treatment method; and a method of cleaning the substrate holding member.
SOLUTION: The substrate holding member 101 is formed into a vertically-opened cylindrical shape. The substrate holding member 101 includes a substrate arrangement part 107 for holding a substrate, and a gripping member insertion part 102 for inserting a gripping member of a transport mechanism therein. The substrate holding member further includes an opening closing member 103 closing an opening 108 for gripping member insertion, formed in an upper part of the gripping member insertion part 102.
COPYRIGHT: (C)2010,JPO&INPIT
摘要（中）：
SOLUTION: The substrate holding member 101 is formed into a vertically-opened cylindrical shape. The substrate holding member 101 includes a substrate arrangement part 107 for holding a substrate, and a gripping member insertion part 102 for inserting a gripping member of a transport mechanism therein. The substrate holding member further includes an opening closing member 103 closing an opening 108 for gripping member insertion, formed in an upper part of the gripping member insertion part 102.
COPYRIGHT: (C)2010,JPO&INPIT
要解决的问题：提供：抑制球形突起的产生的基板保持构件，并且通过提高产品的质量和无缺陷率来降低成本; 底物处理方法; 以及清洁基板保持部件的方法。 解决方案：将基板保持部件101形成为垂直开口的圆筒形状。 基板保持构件101包括用于保持基板的基板布置部107和用于将输送机构的夹持构件插入其中的夹持构件插入部102。 基板保持构件还包括形成在夹持构件插入部102的上部的闭合用于夹持构件插入的开口108的开口关闭构件103.版权所有（C）2010，JPO＆INPIT
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/20 | ....半导体材料在基片上的沉积，例如外延生长 |
| ----------------H01L21/205 | .....应用气态化合物的还原或分解产生固态凝结物的，即化学沉积 |