发明专利
JP2006045666A Sputtering target for thin film formation, dielectric thin film, optical disk, and method for producing the dielectric thin film
审中-公开
基本信息:
- 专利标题: Sputtering target for thin film formation, dielectric thin film, optical disk, and method for producing the dielectric thin film
- 专利标题(中):用于薄膜形成的溅射靶,介质薄膜,光盘,以及用于生产电介质薄膜的方法
- 申请号:JP2005156967 申请日:2005-05-30
- 公开(公告)号:JP2006045666A 公开(公告)日:2006-02-16
- 发明人: HOSODA YASUO , HIGUCHI TAKANOBU , UENO TAKASHI
- 申请人: Dept Corp , Pioneer Electronic Corp , デプト株式会社 , パイオニア株式会社
- 专利权人: Dept Corp,Pioneer Electronic Corp,デプト株式会社,パイオニア株式会社
- 当前专利权人: Dept Corp,Pioneer Electronic Corp,デプト株式会社,パイオニア株式会社
- 优先权: JP2004191149 2004-06-29; JP2005156967 2005-05-30
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; C23C14/08 ; G11B7/254 ; G11B7/257 ; G11B7/26 ; G11B11/105 ; H01J11/22 ; H01J11/34 ; H01J11/38 ; H01J11/40
摘要:
PROBLEM TO BE SOLVED: To prevent the diffusion of water and oxygen from a dielectric protective film by eliminating free oxygen from a thin oxide film without detriment to the characteristics of the film as a dielectric protective film. SOLUTION: A thin film of a mixed oxide comprising niobium oxide and silicon oxide or comprising niobium oxide and titanium oxide is used as a dielectric material for forming a dielectric protective film for an optical disk etc. In a desirable example, a target comprising niobium oxide as a main component and 1 to 30 wt.% of silicon oxide is used in the formation of an oxide thin film by sputtering. In this case, the oxide thin film is formed desirably in a nitrogen atmosphere. A nitrogen-containing oxide thin film is made by sputtering an oxygen-deficient target in the presence of a small amount of added nitrogen. By this way, it is possible to make a thin film having low reducibility and consequent high barrier properties as well as properties equivalent to those of a perfect oxide. COPYRIGHT: (C)2006,JPO&NCIPI
摘要(中):
要解决的问题:通过从薄氧化膜中除去游离氧而不损害作为介电保护膜的特性的特性,防止水和氧从介电保护膜扩散。 解决方案:使用包含氧化铌和氧化硅或包含铌氧化物和氧化钛的混合氧化物的薄膜作为用于形成用于光盘的介电保护膜的电介质材料等。在期望的示例中,靶 以氧化铌作为主要成分,通过溅射形成氧化物薄膜,使用1〜30重量%的氧化硅。 在这种情况下,希望在氮气气氛中形成氧化物薄膜。 通过在少量添加的氮的存在下溅射缺氧靶来制造含氮氧化物薄膜。 通过这种方式,可以制备具有低还原性和随之而来的高阻隔性以及与完全氧化物相当的性质的薄膜。 版权所有(C)2006,JPO&NCIPI