基本信息:
- 专利标题： Part bonding device
- 申请号：JP2003380567 申请日：2003-11-10
- 公开(公告)号：JP2004080055A 公开(公告)日：2004-03-11
- 发明人： OGIMOTO SHINICHI , MAKINO TSUTOMU
- 申请人： Shibaura Mechatronics Corp , 芝浦メカトロニクス株式会社
- 专利权人： Shibaura Mechatronics Corp,芝浦メカトロニクス株式会社
- 当前专利权人： Shibaura Mechatronics Corp,芝浦メカトロニクス株式会社
- 优先权： JP2003380567 2003-11-10
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
PROBLEM TO BE SOLVED: To obtain a part bonding device capable of preventing the deterioration of yield in a bonding process.
SOLUTION: In a part bonding device that carries out temporary press-bonding with a presser for a part 1 supplied to a glass substrate 3 through a bonding material 2 applied to the glass substrate 3, the adhesive strength of temporary press-bonding is increased by installing a heater 11 on the upstream side of a tool holder 13 for temporary press-bonding and preheating the connecting member 2 of the glass substrate 3 supplied to the lower side of the tool holder 13, and the come-off of TCPs 1 generated when carrying from a temporary press-bonding process to a main press-bonding process is prevented. Incidentally, as a heat source, a heater wire or an infrared lamp is preferably used.
COPYRIGHT: (C)2004,JPO
SOLUTION: In a part bonding device that carries out temporary press-bonding with a presser for a part 1 supplied to a glass substrate 3 through a bonding material 2 applied to the glass substrate 3, the adhesive strength of temporary press-bonding is increased by installing a heater 11 on the upstream side of a tool holder 13 for temporary press-bonding and preheating the connecting member 2 of the glass substrate 3 supplied to the lower side of the tool holder 13, and the come-off of TCPs 1 generated when carrying from a temporary press-bonding process to a main press-bonding process is prevented. Incidentally, as a heat source, a heater wire or an infrared lamp is preferably used.
COPYRIGHT: (C)2004,JPO
公开/授权文献:
- JP3898689B2 Parts bonding apparatus 公开/授权日：2007-03-28
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |