专利号EP21196285.7 | OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONFIGURATION DESIGNS IN PACKAGE SUBSTRATE

专利标题： OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONFIGURATION DESIGNS IN PACKAGE SUBSTRATE
申请号：EP21196285.7 申请日：2020-03-18
公开(公告)号：EP3968367A1 公开(公告)日：2022-03-16
发明人： QIAN, Zhiguo , DUAN, Gang , AYGÜN, Kemal , KONG, Jieying
申请人： INTEL Corporation
申请人地址： US Santa Clara, CA 95054 2200 Mission College Blvd.
代理机构： 2SPL Patentanwälte PartG mbB
优先权： US201916392171 20190423
主分类号： H01L23/14
IPC分类号： H01L23/14 ; H01L23/498 ; H01L23/538

摘要：

Embodiments include semiconductor packages and methods of forming the semiconductor packages.

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