基本信息:
- 专利标题： PACKAGING STRUCTURE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
- 申请号：EP19884797.2 申请日：2019-10-29
- 公开(公告)号：EP3883131A1 公开(公告)日：2021-09-22
- 发明人： YANG, Qingrui , PANG, Wei , SUN, Chen , ZHANG, Menglun
- 申请人： Tianjin University , Rofs Microsystem (Tianjin) Co., Ltd
- 申请人地址： CN Tianjin 300072 No.92 Weijin Road Nankai District; CN Tianjin 300462 No. 27 Xinye 5th Street West District Binhai New Area Development Zone
- 代理机构： Bandpay & Greuter
- 优先权： CN201811355758 20181114
- 国际公布： WO2020098483 20200522
- 主分类号： H03H9/54
- IPC分类号： H03H9/54
摘要：
The present invention relates to a packaging structure for a semiconductor device. The semiconductor device includes a first substrate and a second substrate, which are opposite to each other. The packaging structure includes: a gasket structure, protruding from the second substrate toward the first substrate; and an adhesion layer, arranged on the end face of the gasket structure opposite to the first substrate and/or on the surface of the first substrate opposite to the gasket structure, wherein the shape of the cross section of the gasket structure vertical to the extension direction of the gasket is such that the width of the cross section becomes smaller in the protrusion direction of the gasket structure. The present invention further relates to a semiconductor device having the packaging structure, and equipment having the semiconductor device.
IPC结构图谱:
| H | 电学 |
| --H03 | 基本电子电路 |
| ----H03H | 阻抗网络，例如谐振电路；谐振器 |
| ------H03H9/00 | 包括机电或电声元件的网络，如谐振电路 |
| --------H03H9/30 | .时延网络 |
| ----------H03H9/54 | ..包含由压电或电致伸缩材料构成的谐振器 |