基本信息:
- 专利标题： POWER SEMICONDUCTOR MODULES WITH PROTECTIVE COATING
- 申请号：EP17206860.3 申请日：2017-12-13
- 公开(公告)号：EP3336890A1 公开(公告)日：2018-06-20
- 发明人： Bayerer, Reinhold
- 申请人： Infineon Technologies AG
- 申请人地址： Am Campeon 1-12 85579 Neubiberg DE
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： Am Campeon 1-12 85579 Neubiberg DE
- 代理机构： Westphal, Mussgnug & Partner Patentanwälte mbB
- 优先权： US201615380656 20161215
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/29
摘要：
A semiconductor package is described which meets a plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package includes a semiconductor die embedded in or covered by a molded plastic body, the molded plastic body satisfying only a subset of the plurality of predetermined electrical, mechanical, chemical and/or environmental requirements. The semiconductor package further includes a plurality of terminals protruding from the molded plastic body and electrically connected to the semiconductor die, and a coating applied to at least part of the molded plastic body and/or part of the plurality of terminals. The coating satisfies each predetermined electrical, mechanical, chemical and/or environmental requirement not satisfied by the molded plastic body.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/31 | ..按配置特点进行区分的 |