发明公开
EP2803082A1 ELEKTRONISCHES BAUTEIL MIT KORROSIONSGESCHÜTZTER BONDVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DES BAUTEILS
失效 - 权利终止
基本信息:
- 专利标题： ELEKTRONISCHES BAUTEIL MIT KORROSIONSGESCHÜTZTER BONDVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DES BAUTEILS
- 专利标题（英）：Electronic component having a corrosion-protected bonding connection and method for producing the component
- 专利标题（中）：根据上述制造COMPONENT防腐蚀的键合连接和方法电子元件
- 申请号：EP12798672.7 申请日：2012-11-29
- 公开(公告)号：EP2803082A1 公开(公告)日：2014-11-19
- 发明人： DUERR, Johannes , BECKER, Rolf , LAMERS, Sven , MUELLER, Lutz , BEZ, Fabian , SCHLECHT, Michael
- 申请人： Robert Bosch GmbH
- 申请人地址： Postfach 30 02 20 70442 Stuttgart DE
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： Postfach 30 02 20 70442 Stuttgart DE
- 优先权： DE102012200273 20120111
- 国际公布： WO2013104460 20130718
- 主分类号： H01L23/053
- IPC分类号： H01L23/053 ; H01L23/26
摘要：
The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/04 | ..按外形区分的 |
| ------------H01L23/053 | ...中空容器，并有用于半导体本体安装架的绝缘基座 |