基本信息:
- 专利标题： Printed circuit board
- 申请号：EP13162441.3 申请日：2013-04-05
- 公开(公告)号：EP2651199B1 公开(公告)日：2018-02-21
- 发明人： Murai, Yusuke , Hoshi, Sou , Yamashita, Nobuaki
- 申请人： Canon Kabushiki Kaisha
- 申请人地址： 30-2, Shimomaruko 3-chome, Ohta-ku, Tokyo 146-8501 JP
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： 30-2, Shimomaruko 3-chome, Ohta-ku, Tokyo 146-8501 JP
- 代理机构： TBK
- 优先权： JP2012088554 20120409
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
Provided is a printed circuit board 100 capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board 101 including: a power layer 113 having a power pattern 131 formed therein; and a ground layer 112 having a ground pattern 121 formed therein. On the printed wiring board, an LSI 102 as a semiconductor device and an LSI 104 as a power supply member are mounted. The ground pattern has a first ground region R that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion 122 is formed. In the first ground region, the defect portion forms a region 121a that is narrower than the power pattern.
公开/授权文献:
- EP2651199A3 Printed circuit board 公开/授权日：2014-07-02
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |