基本信息:
- 专利标题： PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY
- 申请号：EP04778051 申请日：2004-07-12
- 公开(公告)号：EP1647173A4 公开(公告)日：2017-12-27
- 发明人： PATTERSON JANET
- 申请人： MAXWELL LAB
- 专利权人： MAXWELL LAB
- 当前专利权人： MAXWELL LAB
- 优先权： US62184403 2003-07-16
- 主分类号： H01L23/556
- IPC分类号： H01L23/556 ; H01L23/552 ; H01L25/10 ; H01L25/11 ; H05K9/00
摘要：
A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/556 | ..防α射线的 |