基本信息:
- 专利标题： Component-embedded board fabrication method and apparatus
- 专利标题（中）：嵌入式组件及其制备方法局
- 申请号：EP03015264.9 申请日：2003-07-07
- 公开(公告)号：EP1381080A3 公开(公告)日：2005-08-03
- 发明人： Akagawa, Masatoshi , Sekigawa, Kazunari , Wakabayashi, Shinichi
- 申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.
- 申请人地址： 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 JP
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO. LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO. LTD.
- 当前专利权人地址： 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 JP
- 代理机构： Patentanwälte Ruff, Wilhelm, Beier, Dauster & Partner
- 优先权： JP2002200055 20020709; JP2002352440 20021204
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.
公开/授权文献:
- EP1381080A2 Component-embedded board fabrication method and apparatus 公开/授权日：2004-01-14
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |