基本信息:
- 专利标题： Semiconductor device, semiconductor module and hard disk
- 专利标题（中）：半导体，半导体模块和硬盘驱动器
- 申请号：EP01302542.4 申请日：2001-03-20
- 公开(公告)号：EP1195813A3 公开(公告)日：2005-01-05
- 发明人： Sakamoto, Noriaki , Kobayashi, Yoshiyuki , Sakamoto, Junji , Okada, Yukio , Igarashi, Yusuke , Maehara, Eiju , Takahashi, Kouji
- 申请人： Sanyo Electric Co., Ltd.
- 申请人地址： 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka JP
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka JP
- 代理机构： Nicholls, Michael John
- 优先权： JP2000306667 20001005
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/433 ; H01L23/31 ; H01L21/68
摘要：
A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).
公开/授权文献:
- EP1195813A2 Semiconductor device, semiconductor module and hard disk 公开/授权日：2002-04-10
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/36 | ..为便于冷却或加热对材料或造型的选择，例如散热器 |
| ------------H01L23/367 | ...为便于冷却的器件造型 |