基本信息:
- 专利标题： METHOD OF PACKAGING SEMICONDUCTOR DEVICE USING ANISOTROPIC CONDUCTIVE ADHESIVE
- 专利标题（中）：封装用半导体布置WITH A各向异性导电粘接剂
- 申请号：EP00901937.3 申请日：2000-01-27
- 公开(公告)号：EP1067598B1 公开(公告)日：2003-03-26
- 发明人： WATANABE, Makoto, Citizen Watch Co., Ltd.
- 申请人： Citizen Watch Co. Ltd.
- 申请人地址： 1-12, Tanashicho 6-chome, Nishitokyo-shi Tokyo 188-8511 JP
- 专利权人： Citizen Watch Co. Ltd.
- 当前专利权人： Citizen Watch Co. Ltd.
- 当前专利权人地址： 1-12, Tanashicho 6-chome, Nishitokyo-shi Tokyo 188-8511 JP
- 代理机构： Prüfer, Lutz H., Dipl.-Phys.
- 优先权： JP1848799 19990127
- 国际公布： WO00045431 20000803
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/311 ; H05K3/32
摘要：
A circuit board (17) is provided with anisotropic conductive adhesive (13). Projection electrodes (14) provided on a semiconductor device (16) are positioned to wiring patterns (15) on the circuit board (17). The semiconductor device (16) is mounted on the circuit board (17). The semiconductor device (16) is preliminarily attached to the circuit board (17) by a thermocompression tool (18) at lower temperature than the hardening temperature of the adhesive resin (11) of the anisotropic conducting adhesive (13). The semiconductor device (16) is finally bonded to the circuit board (17) by heating the adhesive resin (11) at its hardening temperature.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |