基本信息:
- 专利标题： COMBINED CUTTING AND GRINDING TOOL
- 专利标题（中）：联合切削和磨削工具
- 申请号：EP98923108 申请日：1998-06-03
- 公开(公告)号：EP0917931A4 公开(公告)日：2003-01-15
- 发明人： OHMORI HITOSHI , MORIYASU SEI , NAKAGAWA TAKEO
- 申请人： RIKAGAKU KENKYUSHO
- 专利权人： RIKAGAKU KENKYUSHO
- 当前专利权人： RIKAGAKU KENKYUSHO
- 优先权： JP14796397 1997-06-05
- 主分类号： B24B53/00
- IPC分类号： B24B53/00 ; B24D3/00 ; B24D3/34 ; B24D5/06 ; B24D7/06
摘要：
A combined cutting and grinding tool comprising columnar diamonds (22) arranged so as to protrude from the surface of the tool and conductive bonding member (24) for integrally bonding the columnar diamonds (22) to the surface of the tool, wherein the bonding member (24) performs electrolytic dressing while allowing a conductive fluid to flow between the same and electrodes (4) facing the same at intervals, whereby the columnar diamonds (22) can protrude. This arrangement makes it roughly work a ductile material with a large depth of cut, to precisely grind a brittle material with efficiency and stability and to offset variation in working position due to abrasion.
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B53/00 | 用于修整或调节研磨表面的装置或工具 |