![MIKROGALVANISCH HERGESTELLTES BAUTEIL](/ep/2001/10/10/EP0902848B1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: MIKROGALVANISCH HERGESTELLTES BAUTEIL
- 专利标题(英):Component produced by micro-electrodeposition
- 专利标题(中):Microgalvanically组分制成
- 申请号:EP97949953.0 申请日:1997-11-19
- 公开(公告)号:EP0902848B1 公开(公告)日:2001-10-10
- 发明人: HEYSE, Jörg
- 申请人: ROBERT BOSCH GMBH
- 申请人地址: Postfach 30 02 20 70442 Stuttgart DE
- 专利权人: ROBERT BOSCH GMBH
- 当前专利权人: ROBERT BOSCH GMBH
- 当前专利权人地址: Postfach 30 02 20 70442 Stuttgart DE
- 优先权: DE19703080 19970129
- 国际公布: WO9833958 19980806
- 主分类号: C25D1/08
- IPC分类号: C25D1/08 ; C25D1/00
摘要:
The invention relates to a component (23), characterized in that it comprises a plurality of layers (32, 33) functional planes which are built up on each other by micro-electrodeposition. At least one coding mark (60), which is optically readable from the exterior, and is produced during electrodeposition is provided on at least one of the functional planes forming an outer limit of the component (23). The component (23) is suitable as a perforated disk, particularly for use in injection valves, ink jet printers, for spraying or injecting liquids, or for pulverizing medicines.
公开/授权文献:
- EP0902848A1 MIKROGALVANISCH HERGESTELLTES BAUTEIL 公开/授权日:1999-03-24
IPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25D | 覆层的电解或电泳生产工艺方法;电铸;工件的电解法接合;所用的装置 |
------C25D1/00 | 电铸 |
--------C25D1/08 | .多孔制品或小孔制品,例如筛网 |