A method of making a current sensor device is disclosed wherein a sensor, having a magnetoresistive element configured into a bridge (9), an insulating substrate (2) and a conductive member (5) are sub-assembled and then the sub-assembly is heated to bond the components together. The bridge (9) is attached to a first substrate having a first layer of insulation (16) with first vias (17) therein in which are deposited first elements (12a) of (e.g.) solder projecting beyond the first layer of insulation. Second elements (12b) of (e.g.) solder are deposited in second vias (17) in a second layer of insulation (19) on the second substrate (2). When the components are sub-assembled, the first elements (12a) rest on the second elements to provide a clearance between the first and second layers (16, 19) of insulation. Heat is applied to the sub-assembly in a controlled manner so that the (solder) elements (12) melt sufficiently to cause a degree of self-alignment between the bridge (9) and the conductive member and to cause the bridge (9) to be disposed at a predetermined distance above the conductive member (5).