![一种3D打印制备的耐高温漆包导线及制备方法](/CN/2019/1/109/images/201910548202.jpg)
基本信息:
- 专利标题: 一种3D打印制备的耐高温漆包导线及制备方法
- 专利标题(英):High-temperature-resistant enameled wire prepared by 3D printing and preparation method thereof
- 申请号:CN201910548202.2 申请日:2019-06-24
- 公开(公告)号:CN110322988A 公开(公告)日:2019-10-11
- 发明人: 王晓龙 , 郭玉雄 , 苟明霞 , 将盼 , 陈革新 , 周峰
- 申请人: 义乌市中科院兰州化物所功能材料中心 , 中国科学院兰州化学物理研究所
- 申请人地址: 浙江省金华市雪峰西路968号3号楼二层西201
- 专利权人: 义乌市中科院兰州化物所功能材料中心,中国科学院兰州化学物理研究所
- 当前专利权人: 烟台润创工业科技有限公司
- 当前专利权人地址: 265500 山东省烟台市中国(山东)自由贸易试验区烟台片区南昌大街3号1#成品仓库507、513号
- 代理机构: 浙江千克知识产权代理有限公司
- 代理人: 王丰毅
- 主分类号: H01B7/00
- IPC分类号: H01B7/00 ; H01B7/02 ; H01B7/04 ; H01B7/29 ; H01B1/02 ; H01B1/04 ; H01B3/30 ; H01B13/00 ; H01B13/06 ; H01B13/14 ; H01B13/16
The invention relates to a high-temperature-resistant enameled wire prepared by 3D printing and a preparation method thereof, and belongs to the technical field of enamelled wires. The method is characterized in that conductive object powder is prepared into slurry or commercial conductive slurry is directly printed into a conductive inner core in a 3D printing mode, a high-temperature insulatingmaterial is prepared into thick slurry and then a high-temperature insulating material outer layer is obtained in the 3D printing mode; the conductive slurry or the powder is one or several kinds of graphene, graphite powder, carbon paste, conductive metal or modified ceramic; and the high-temperature-resistant insulating material is high-temperature-resistant insulating polyimide. The enameled wire prepared by the preparation method disclosed by the invention is excellent in mechanical property, chemical property, electrical property and thermal property; and the preparation method greatly simplifies the manufacturing process, the path can be designed, and the size can be customized, quick manufacturing is realized, and the method is particularly suitable for preparation of a small-diameter and micron-sized diameter enameled wire in batches, and provides a brand-new method for preparing the enameled wire.
公开/授权文献:
- CN110322988B 一种3D打印制备的耐高温漆包导线及制备方法 公开/授权日:2020-11-03
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01B | 电缆;导体;绝缘体;导电、绝缘或介电材料的选择 |
------H01B7/00 | 按形状区分的绝缘导体或电缆 |