
基本信息:
- 专利标题: 一种贴片式通信线路保护器及其制造方法
- 专利标题(英):Patch-type communication line protector and manufacturing method thereof
- 申请号:CN201910403251.7 申请日:2019-05-15
- 公开(公告)号:CN110136903A 公开(公告)日:2019-08-16
- 发明人: 李峰 , 韩乔磊 , 王开成 , 张锐 , 钱朝勇 , 沈十林
- 申请人: 上海长园维安电子线路保护有限公司
- 申请人地址: 上海市浦东新区施湾七路1001号
- 专利权人: 上海长园维安电子线路保护有限公司
- 当前专利权人: 上海维安电子股份有限公司
- 当前专利权人地址: 200083 上海市虹口区柳营路125号8楼806室
- 代理机构: 上海东亚专利商标代理有限公司
- 代理人: 董梅
- 主分类号: H01C7/00
- IPC分类号: H01C7/00 ; H01C1/14 ; H01C1/022 ; H01C17/02 ; H01C17/28
The invention provides a patch-type communication line protector and a manufacturing method thereof. The patch-type communication line protector at least comprises pin electrode sheets, thermistor chips and a shell. The thickness of the pin electrode sheets is not more than 0.4mm. Each pin electrode sheet is provided with a pin spring on one side and a buckle on at least one end, and is fixed to the shell by the buckle(s). The thermistor chips are sheet-like structures, and are communicated with the pin electrode sheets through the surface electrode layers on the two sides of the sheet-like structures. The shell does not deform at least at high temperature of 260 DEG C, and is opened at the bottom. The inside of the shell is divided into 2-4 independent spaces by partition layers. One thermistor chip is installed in each independent space, and the two sides of the thermistor chips are connected with the pin electrode sheets through pin spring contacts. Surface mounting can be completedby one-time reflow welding of the whole board, the automation degree and production efficiency of the security unit are greatly improved, and the processing cost is greatly lowered.