The invention provides a microelectronic device packaging welding machine and relates to the technical field of microelectronics. The microelectronic device packaging welding machine comprises a baseand is characterized in that a slide groove is formed inside the base, a slide rod is welded between the left inner wall and the right inner wall of the slide groove, two movable rings are movably connected to the surface of the slide rod, a connecting rod is welded to the top of each movable ring, and a support plate is welded to each of the left side and the right side of the top of the base. The microelectronic device packaging welding machine has the advantages that the microelectronic device packaging welding machine is provided with first telescopic rods, connecting plates, clamp platesand antiskid plates, the connecting plates move oppositely to drive the clamp plates to move oppositely to clamp an object, squeezing blocks can move oppositely to further fix the object by the aid ofmovable rods, the squeezing blocks, antiskid pads, annular blocks and threaded rods, and the precision of the microelectronic device packaging welding machine during welding is increased effectively.